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HPX-850 Backfill System

HPX-850 is a lightweight, heat-resistant, two-component epoxy back-fill system. Like BC7020, the filler portion is pre-blended into the resin and hardener components for easier handling, thus simplifying the mixing process. The advantages of HPX-850 include low cost, long pot life, machineability, and low shrinkage. HPX-850 is ideally suited for numerous applications involving mold and core construction.

Product Features:

Mix ratio: 6:1 by wt.
Pot life: 2–2.5 hours
Viscosity (Mixed) @ 75°F: Paste
Cure schedule: See Tech Data Sheet
Color: Gray

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